Mixed-signal IP joins the renowned digital IP cores for USB 2.0 devices and constitutes a fully operational solution for most recent technology nodes.
Join LeCroy and Evatronix for a real-life engineering guide on the USB 3.0 standard and its hardware and software limitations.
Direct chip-to-chip interconnect allows significant power and silicon area savings while retaining all performance features of the USB 2.0 standard.
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